
Key Features
| Imaging Method | Dynamic Imaging |
| Camera | 4 Mpix |
| Imaging Resolution | 10 µm or 15 µm (factory setting) |
| Lighting | RGB LED |
| 3D Technology | 2-way Digital Fringe Pattern |
| Field of View | 4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm |
| Imaging Speed | 4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec |
| Height Resolution | 0.4 µm |
| Max. Solder Height | @ 10 µm: 420 µm @ 15 µm: 385 µm |
| X-Axis Control | Linear Motor and linear scale with DSP-based controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 0.5 µm |
| Z-Axis Resolution | 1 µm |
| Max PCB Size | TR7007 SII Plus: 510 x 460 mm TR7007L SII Plus: 660 x 610 mm TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
| WxDxH | TR7007 SII Plus: 1100 x 1570 x 1550 TR7007L SII Plus: 1300 x 1610 x 1560 mm TR7007 SII Plus DL: 1100 x 1770 x 1560 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7007 SII Plus: 950 kg TR7007L SII Plus: 1250 kg TR7007 SII Plus DL: 1100 kg |
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